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公(gong)司成立于2019年9月(yue)4日(ri)，注冊資(zi)金一(yi)(yi)億元(yuan)。位(wei)于日(ri)照(zhao)高新區(qu)智慧微(wei)電(dian)產(chan)(chan)(chan)(chan)(chan)業(ye)園B1棟,主(zhu)要產(chan)(chan)(chan)(chan)(chan)品(pin)為5G通(tong)信(xin)類聲(sheng)表(biao)面波(bo)(bo)濾波(bo)(bo)器(qi)(qi)、諧(xie)振(zhen)器(qi)(qi)、雙(shuang)工(gong)器(qi)(qi)晶(jing)(jing)圓(yuan)及SMD、CSP封裝產(chan)(chan)(chan)(chan)(chan)品(pin)，包括LN、LT晶(jing)(jing)片(pian)及芯片(pian)的自(zi)主(zhu)設計、制(zhi)造生(sheng)產(chan)(chan)(chan)(chan)(chan)。同時研發生(sheng)產(chan)(chan)(chan)(chan)(chan)5G通(tong)信(xin)用電(dian)力電(dian)子保護元(yuan)件陶瓷放電(dian)管產(chan)(chan)(chan)(chan)(chan)品(pin)，產(chan)(chan)(chan)(chan)(chan)品(pin)擁(yong)有(you)自(zi)主(zhu)知識產(chan)(chan)(chan)(chan)(chan)權(quan)，是(shi)一(yi)(yi)家高科技技術(shu)企業(ye)。